Thermomechanical Stress-Aware Management For 3D Ic Designs at 3D Designs

Thermomechanical Stress-Aware Management For 3D Ic Designs. Columbia university, new york, ny, usa, yuan xie. (b) tsv bus is placed vertically to for reduced thermal load.

To address the stress issue, we propose a thorough solution that combines. Department of computer science, zhejiang university of science and technology, hangzhou, china , eren kursun. Zou, tao zhang, eren kursun, and yuan xie.

Comparison between gatelevel and blocklevel design

Columbia university, new york, ny, usa, yuan xie. Qiaosha zou, eren kursun, yuan xie. (a) tsv bus is placed horizontally between execution units of two cores, resulting in higher tsv temperature; Department of computer science, zhejiang university of science and technology, hangzhou, china , eren kursun.